Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | Depth | Operating Supply Voltage | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | REACH SVHC | Frequency | Height | Width | Mounting Type | Operating Temperature | Size / Dimension | Technology | Max Supply Current | Bandwidth | Height Seated (Max) | Ratings | Manufacturer Package Identifier | Capacitance | HTS Code | Number of Functions | Physical Dimension | Nominal Supply Current | Type | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Sensitivity | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Number of Channels | Subcategory | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Max Power Dissipation | Data Rate | Frequency Stability | Load Capacitance | Operating Frequency | Output | Watchdog Timer | Speed | Rise Time-Max | Fall Time-Max | Symmetry-Max | Oscillator Type | Access Time | Power - Output | Screening Level | Memory Size | Function | Core Processor | Number of GPIO | RAM Size | Number of I/O | Telecom IC Type | Voltage - Supply | Protocol | Data Bus Width | Number of Timers/Counters | uPs/uCs/Peripheral ICs Type | Peripherals | RAM (words) | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Max Duty Cycle | On Chip Data RAM Width | Current - Supply (Max) | Voltage - Supply (Vcc/Vdd) | Sensitivity (dBm) | Utilized IC / Part | RF Family/Standard | Antenna Type | Current - Receiving | Current - Transmitting | Number of ADC Channels | Serial Interfaces | Modulation | Firmware Version | Program Memory Type | Base Resonator | Current - Supply (Disable) (Max) | Core Size | Program Memory Size |
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BM71BLES1FC2-0B02AA | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | 2017 | yes | Active | 1 (Unlimited) | 16 | ROHS3 Compliant | Module | I2C, SPI, UART | 2.4GHz | 2.1mm | Surface Mount | -40°C~85°C | BM71BLES1FC2-0B02AA | 1 | UNSPECIFIED | NO LEAD | 260 | 3V | 30 | BM71 | -90dBm | YES | 1.2mm | R-XXMA-N16 | 85°C | 8.6 kbps | 2dBm | 9 | TELECOM CIRCUIT | 1.9V~3.6V | Bluetooth v5.0 | Bluetooth | Integrated, Chip | 10mA~13mA | 13mA | 5 | UART | 1.06 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
RN4871-I/RM140 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Active | 16 | 11.5mm | ROHS3 Compliant | 16-SMD Module | 2.402GHz~2.48GHz | 9mm | Surface Mount | -40°C~85°C | 2.16mm | 1 | UNSPECIFIED | NO LEAD | 3.3V | -90dBm | YES | 1.2mm | R-XXMA-N16 | 10kbps | 0dBm | TS 16949 | TELECOM CIRCUIT | 1.9V~3.6V | Bluetooth v4.2 | RN4871 | Bluetooth | Integrated, Chip | 13mA | I2C, AIO, PIO, PWM, SPI, UART | GFSK | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
BM71BLES1FC2-0002AA | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Surface Mount | Tray | 2017 | yes | Active | 1 (Unlimited) | 16 | 11.5mm | ROHS3 Compliant | Lead Free | Module | I2C, SPI, UART | 2.4GHz~2.48GHz | 9mm | Surface Mount | -20°C~70°C | 2.1mm | 1 | UNSPECIFIED | NO LEAD | 3V | BM71 | 1.2mm | R-XXMA-N16 | 8.6 kbps | 0dBm | TELECOM CIRCUIT | 1.9V~3.6V | Bluetooth v5.0 | -90 dBm | Bluetooth | Integrated, Chip | 13mA | I2C, SPI, UART | 1.06 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
ATWILC1000-MR110PB | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Surface Mount | Tray | 2015 | yes | Active | 3 (168 Hours) | 28 | 21.72mm | ROHS3 Compliant | Lead Free | 40 | 28-SMD Module, Exposed Pad | I2C, SPI, UART | 2.4GHz | 2.113mm | Surface Mount | -40°C~85°C | CMOS | 60MHz | 1 | 22mA | UNSPECIFIED | NO LEAD | 3.6V | ATWILC1000 | R-XXMA-N28 | 72.2Mbps | 19dBm | 5 | TELECOM CIRCUIT | 3.3V~4.3V | 802.11b/g/n | -98 dBm | WiFi | Integrated, Trace | 29mA~68mA | 29mA~230mA | I2C, SDIO, SPI, UART | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
BM78SPPS5NC2-0002AA | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Bulk | Active | 1 (Unlimited) | ROHS3 Compliant | Lead Free | Module | I2C, UART | No SVHC | 2.4GHz | 2.2mm | Surface Mount | -20°C~70°C | 78MHz | 8542.39.00.01 | 1 | UNSPECIFIED | NO LEAD | 1.9V | BM78 | -92dBm | YES | X-XXMA-N | 70°C | 1.5Gbps | 1.5dBm | 7 | TELECOM CIRCUIT | 3.3V~4.2V | Bluetooth v4.2 | Bluetooth | Integrated, Chip | 37mA | 43mA | UART | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
ATWILC1000-MR110UB | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tray | 2016 | Active | 3 (168 Hours) | 28 | 21.72mm | ROHS3 Compliant | 40 | 28-SMD Module, Exposed Pad | I2C, SPI, UART | 2.4GHz | 14.73mm | Surface Mount | -40°C~85°C | CMOS | 2.113mm | 8542.39.00.01 | 1 | UNSPECIFIED | NO LEAD | 3.6V | ATWILC1000 | R-XXMA-N28 | 65Mbps | 19dBm | TELECOM CIRCUIT | 3.3V | 802.11b/g/n | -98 dBm | WiFi | Antenna Not Included, U.FL | 68mA | 230mA | I2C, SPI, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
ATWINC1510-MR210PB | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tray | 2015 | yes | Active | 3 (168 Hours) | 28 | 3.6V | ROHS3 Compliant | Lead Free | 40 | SEATED HGT-NOM | Module | I2C, SPI, UART | 2.4GHz | Surface Mount | -40°C~85°C | CMOS | UNSPECIFIED | NO LEAD | NOT SPECIFIED | 3.6V | NOT SPECIFIED | -95dBm | R-XXMA-N28 | 1 | 72.2Mbps | 18.5dBm | 8MB Flash 128kB RAM | 2.7V~3.6V | 802.11b/g/n | MICROPROCESSOR CIRCUIT | -98 dBm | WiFi | Integrated, Trace | 61mA | 265mA | I2C, SPI, UART | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | 19.4.4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MRF24J40MA-I/RM | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Surface Mount | Tray | 2008 | Active | 3 (168 Hours) | 12 | 17.78mm | 3.3V | 27.9mm | ROHS3 Compliant | Lead Free | Tin | No | 12 | Module | No SVHC | 2.4GHz | 890μm | 17.78mm | Surface Mount | -40°C~85°C | 23mA | 3.3V | MRF24J40M | Other Telecom ICs | 250kbps | 0dBm | 2.4V~3.6V | Zigbee® | -94 dBm | 802.15.4 | Integrated, Trace | 19mA | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
RN4678-V/RM100 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 20 Weeks | Tray | 2018 | Active | 1 (Unlimited) | 33 | 22mm | ROHS3 Compliant | Lead Free | Module | No SVHC | 2.4GHz | 2.4mm | 12mm | Surface Mount | -20°C~70°C | 8542.39.00.01 | 1 | UNSPECIFIED | NO LEAD | 1.9V | RN4678 | -92dBm | YES | R-XXMA-N33 | 70°C | 1Mbps | 1.5dBm | TS 16949 | 4MB Flash 320kB ROM 28kB SRAM | TELECOM CIRCUIT | 3.3V~4.2V | Bluetooth v5.0 | Bluetooth | Integrated, Chip | 37mA | 43mA | UART | 1.0.0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001DL2-024.0000T | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 9 Weeks | Standard, Surface Mount | Tape & Reel (TR) | DSC1001 | yes | Active | 3 (168 Hours) | Solder | 3.3V | ROHS3 Compliant | 4-VDFN | 24MHz | 889μm | Surface Mount | -40°C~105°C | 0.098Lx0.079W 2.50mmx2.00mm | 6.3mA | 0.035 0.90mm | AEC-Q100 | 2.5mm x 2.0mm x 0.85mm | XO (Standard) | e3 | Matte Tin (Sn) | 3.3V | ±25ppm | 15pF | 24MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | 55 % | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
RN42NU-I/RM | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tray | 2010 | Active | 3 (168 Hours) | 32 | 20.5mm | ROHS3 Compliant | Lead Free | No | 35 | Module | SPI, UART, USB | 2.4GHz | 13.4mm | Surface Mount | -40°C~85°C | 2.4mm | 1 | UNSPECIFIED | 3.3V | RN42 | R-XXMA-N32 | 3Mbps | 4dBm | TS 16949 | TELECOM CIRCUIT | 3V~3.6V | Bluetooth v2.1 +EDR, Class 2 | -80 dBm | Bluetooth | Antenna Not Included, U.FL | 45mA | 30mA | USB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
BM23SPKA1NB9-0001AA | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tray | 2015 | yes | Obsolete | 3 (168 Hours) | 43 | 29mm | ROHS3 Compliant | 43-SMD Module | UART | 2.4GHz | 15mm | Surface Mount | -20°C~70°C | 1.9mm | 1 | UNSPECIFIED | NO LEAD | 3.7V | BM23 | 1.2mm | R-XXMA-N43 | 4dBm | TELECOM CIRCUIT | 3V~4.2V | Bluetooth v4.1 | -91 dBm | Bluetooth | Integrated, Trace | I2S, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MRF24WG0MAT-I/RM | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tape & Reel (TR) | 2012 | Active | 3 (168 Hours) | 36 | 21mm | 3.6V | 31mm | ROHS3 Compliant | No | 36 | 36-SMD Module | 2.4GHz | Surface Mount | -40°C~85°C | 8542.39.00.01 | 3.3V | MRF24WG0M | 11 | Other Telecom ICs | 3.3V | 54Mbps | 18dBm | 2.8V~3.6V | 802.11b/g | -95 dBm | WiFi | Integrated, Trace | 156mA | 226mA~237mA | SPI | DSSS, OFDM | 310C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MICRF620Z TR | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | 2006 | RadioWire® | Obsolete | 2 (1 Year) | ROHS3 Compliant | Module | 433MHz | Surface Mount | -20°C~75°C | -111dBm | 20kbps | 9dBm | 2V~2.5V | General ISM < 1GHz | Integrated, Trace | 12mA | 24mA | FSK | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1121CI1-024.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Standard, Surface Mount | Tube | DSC1121 | yes | Active | 3 (168 Hours) | SMD/SMT | ROHS3 Compliant | 6-SMD, No Lead | 24MHz | 889μm | Surface Mount | -40°C~85°C | 0.126Lx0.098W 3.20mmx2.50mm | 35mA | 0.035 0.90mm | AEC-Q100 | 3.2mm x 2.5mm x 0.9mm | XO (Standard) | ±50ppm | 15pF | 24MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 2.25V~3.6V | MEMS | 22mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001BI2-012.0000T | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Standard, Surface Mount | Tape & Reel (TR) | DSC1001 | yes | Active | 3 (168 Hours) | Solder | 3.3V | ROHS3 Compliant | 4-SMD, No Lead | 12MHz | 889μm | Surface Mount | -40°C~85°C | 0.197Lx0.126W 5.00mmx3.20mm | 6.3mA | 0.035 0.90mm | AEC-Q100 | 5.0mm x 3.2mm x 0.85mm | XO (Standard) | e3 | Matte Tin (Sn) | 3.3V | ±25ppm | 15pF | 12MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | 55 % | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001BI2-024.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1001 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 4-SMD, No Lead | 24MHz | 889μm | Surface Mount | -40°C~85°C | 0.197Lx0.126W 5.00mmx3.20mm | 6.3mA | 0.035 0.90mm | AEC-Q100 | 5.0mm x 3.2mm x 0.85mm | XO (Standard) | e3 | Matte Tin (Sn) | 3.3V | ±25ppm | 24MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001CL1-001.6000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1001 | yes | Active | 3 (168 Hours) | 4 | ROHS3 Compliant | ALSO OPERATES AT 2.5V AND 1.8V SUPPLY VOLTAGE | 4-SMD, No Lead | 1.6MHz | 889μm | Surface Mount | -40°C~105°C | 0.126Lx0.098W 3.20mmx2.50mm | 6.3mA | 0.035 0.90mm | AEC-Q100 | 3.2mm x 2.5mm x 0.9mm | XO (Standard) | 3.3V | ±50ppm | 1.6MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001BI2-002.0480T | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tape & Reel (TR) | DSC1001 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 4-SMD, No Lead | 2.048MHz | 889μm | Surface Mount | -40°C~85°C | 0.197Lx0.126W 5.00mmx3.20mm | 6.3mA | 0.035 0.90mm | AEC-Q100 | 5.0mm x 3.2mm x 0.85mm | XO (Standard) | 3.3V | ±25ppm | 2.048MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001BI2-004.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tube | DSC1001 | Active | 1 (Unlimited) | 4 | ROHS3 Compliant | ALSO OPERATES AT 2.5V AND 1.8V SUPPLY VOLTAGE | 4-SMD, No Lead | 4MHz | Surface Mount | -40°C~85°C | 0.197Lx0.126W 5.00mmx3.20mm | 0.035 0.90mm | AEC-Q100 | 5.0mm x 3.2mm x 0.9mm | XO (Standard) | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3.3V | YES | ±25ppm | 4MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | 6.3mA | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1101CI1-025.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1101 | Active | 3 (168 Hours) | ROHS3 Compliant | 4-SMD, No Lead | 25MHz | 889μm | Surface Mount | -40°C~85°C | 0.126Lx0.098W 3.20mmx2.50mm | 35mA | 0.035 0.90mm | 3.2mm x 2.5mm x 0.85mm | XO (Standard) | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | ±50ppm | 25MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 2.25V~3.6V | MEMS | 95μA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1004AI2-040.0000T | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Standard, Surface Mount | Tape & Reel (TR) | DSC1004 | yes | Active | 3 (168 Hours) | Solder | 3.3V | ROHS3 Compliant | 4-SMD, No Lead Exposed Pad | 40MHz | 889μm | Surface Mount | -40°C~85°C | 0.276Lx0.197W 7.00mmx5.00mm | 8mA | 0.035 0.90mm | AEC-Q100 | 7.0mm x 5.0mm x 0.85mm | XO (Standard) | 3.3V | ±25ppm | 40pF | 40MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | 55 % | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001BI2-026.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1001 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 4-SMD, No Lead | 26MHz | 889μm | Surface Mount | -40°C~85°C | 0.197Lx0.126W 5.00mmx3.20mm | 6.3mA | 0.035 0.90mm | AEC-Q100 | 5.0mm x 3.2mm x 0.85mm | XO (Standard) | e3 | Matte Tin (Sn) | 3.3V | ±25ppm | 26MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 1.8V~3.3V | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001BI2-013.0810 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tube | DSC1001 | Active | 1 (Unlimited) | 4 | ROHS3 Compliant | ALSO OPERATES AT 2.5V AND 1.8V SUPPLY VOLTAGE | 4-SMD, No Lead | 13.081MHz | Surface Mount | -40°C~85°C | 0.197Lx0.126W 5.00mmx3.20mm | 0.035 0.90mm | AEC-Q100 | 5.0mm x 3.2mm x 0.9mm | XO (Standard) | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3.3V | YES | ±25ppm | 13.081MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | 6.3mA | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1101BE1-050.0000T | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tape & Reel (TR) | DSC1101 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | STANDBY; ENABLE/DISABLE FUNCTION; TR | 6-SMD, No Lead | 50MHz | 889μm | Surface Mount | -20°C~70°C | 0.197Lx0.126W 5.00mmx3.20mm | 35mA | 0.035 0.90mm | 15pF | 5.0mm x 3.2mm x 0.85mm | XO (Standard) | ±50ppm | 50MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 2.25V~3.6V | MEMS | 95μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1101AE1-050.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Standard, Surface Mount | Tube | DSC1101 | yes | Active | 3 (168 Hours) | Solder | ROHS3 Compliant | 6-SMD, No Lead | 50MHz | 889μm | Surface Mount | -20°C~70°C | 0.276Lx0.197W 7.00mmx5.00mm | 35mA | 0.035 0.90mm | 7.0mm x 5.0mm x 0.9mm | XO (Standard) | ±50ppm | 15pF | 50MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 2.25V~3.6V | 55 % | MEMS | 95μA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001DL2-025.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 9 Weeks | Surface Mount | Tube | DSC1001 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 4-SMD, No Lead | 25MHz | 889μm | Surface Mount | -40°C~105°C | 0.098Lx0.079W 2.50mmx2.00mm | 6.3mA | 0.035 0.90mm | AEC-Q100 | 2.5mm x 2.0mm x 0.85mm | XO (Standard) | e3 | Matte Tin (Sn) | 3.3V | ±25ppm | 25MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001AI2-054.0000T | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Standard, Surface Mount | Tape & Reel (TR) | DSC1001 | yes | Active | 3 (168 Hours) | Solder | 3.3V | ROHS3 Compliant | 4-SMD, No Lead Exposed Pad | 54MHz | 889μm | Surface Mount | -40°C~85°C | 0.276Lx0.197W 7.00mmx5.00mm | 7.2mA | 0.035 0.90mm | AEC-Q100 | 7.0mm x 5.0mm x 0.85mm | XO (Standard) | 3.3V | ±25ppm | 15pF | 54MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | 55 % | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC1001DL2-030.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 9 Weeks | Surface Mount | Tube | DSC1001 | yes | Active | 1 (Unlimited) | ROHS3 Compliant | 4-SMD, No Lead | 30MHz | 889μm | Surface Mount | -40°C~105°C | 0.098Lx0.079W 2.50mmx2.00mm | 7.2mA | 0.035 0.90mm | AEC-Q100 | 2.5mm x 2.0mm x 0.85mm | XO (Standard) | 3.3V | ±25ppm | 30MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | MEMS | 15μA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PIC16C57-LP/P | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tube | 1998 | PIC® 16C | yes | Active | Not Applicable | 28 | 36.32mm | ROHS3 Compliant | Lead Free | No | 28 | 28-DIP (0.600, 15.24mm) | RS-232 | 40kHz | Through Hole | 0°C~70°C TA | CMOS | 4.83mm | DUAL | 5V | PIC16C57 | 28 | NO | 2.54mm | 2.5V | 6.25V | 1W | Yes | 40 MHz | External | 40 ms | 3kB | PIC | 72 x 8 | 20 | 8b | 1 | MICROCONTROLLER, RISC | POR, WDT | 72 | 8 | NO | NO | NO | NO | 8 | 2.5V~6.25V | OTP | 8-Bit | 3KB 2K x 12 |
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